SMT Pick & Place
General Description
Epk-II SMT:  

The Electrovert Wavesolder Machine is a high quality wave soldering system featuring the additional requirements for automatic soldering of surface mounted devices (SMDs). It also features small size, ease of access, and ergonomic design. Full access to modules allow for easy cleaning and maintenance, and its human engineered form make it an attractive addition to today's clean and modern plants.

Standard Equipment
Computer Control System:  

The computer functions as the control center of all decisions involving the operations of the wavesoldering system. It receives inputs from thermal probes and other sensing devices used throughout the system. The computer compares this data to the process parameters (set points) and precisely controls the various speeds, temperatures, solder wave requirements, etc. The computer is operated from the control console, consisting of two 4 x 4 keypads separated by a LED display window. Set points and control commands are entered via the keypads. System status, process parameters, alarm messages, etc. appear in the display window.

Emergency Controls:  

Two (2) red emergency stop push buttons are mounted, one at each front corner of the system cabinet. This control is used to stop all system operations, including conveyor motion, but does not shut off the solder heaters. If activated while a card is being processed, the card would remain where it was stopped within the conveyor path. This could expose the card to potentially damaging environmental conditions.

Construction and Enclosure:  

The frame is a sturdy welded steel structure supported off the floor by eight (8) leveling feet/pads. It includes a bolt-on roll out stand which enables the solder module to be rolled out to its full service position. Also featured is a one-piece hinged hood that enables full access to all modules. Interior hood lights and front viewing windows which enable full viewing of production processes when the hood is closed.

Pallet Conveyor System:  

The variable speed pallet conveyor transports the carrier (which holds the pcb) through the three process stages of fluxing, preheating and wave soldering. The conveyor consists of two roller chains (one front and one rear) each mounted in respective front and rear rails with a 6° incline to optimize soldering results.

Foam Fluxer:  

The foam fluxer is designed to produce the finest possible foaming action consistent with the properties of the flux being used. A layer of flux is deposited on the underside of the board resulting in minimum residue after the soldering operation. The fluxer is constructed of Titanium which will handle most of the fluxes encountered in the electronics industry. Low pressure compressed air is diffused through double aerator tubes to form a foam head of uniform bubble size. An adjustable air knife removes excess flux to minimize drippings and waste. Separate air gauges and regulators are provided for each aerator and air knife.


The infrared preheater thermally conditions the board prior to soldering. The IR preheater consists of a stainless steel box enclosure fitted with three banks of heating tubes which may be switched independently. The heating elements which run parallel to conveyor travel, are fitted with highly resistant insulators. The tubes are protected by a heat treated, high impact, ceramic glass panel, which is secured by four latch clamps. The enclosure cavity is insulated on the sides and the bottom. The terminal box is located on the underside of the. preheater. Each set of two elements are plugged into separate terminal blocks, for ease of replacement. The preheater assembly is supported from the conveyor rails via support brackets. For servicing, the preheater can be disconnected and lifted out from the supports. Preheat temperature is controlled electronically. Each preheater is divided into 3 zones, separately selected by the operator. The LED display shows the actual and set point temperatures.

Heat Tunnel:  

Mounted over the IR preheater(s), used to reduce heat loss. This unit is easily removed for ready access to the rail, preheater module, or conveyor.

Time Clock:  

A battery backed, real time clock mounted on the microprocessor board to allow preshift start up of the solder heaters for clock controlled solder melting.

Automatic Start Operation:  

A sensor located at the load end entrance of the conveyor senses the PCB as it enters the system for processing. When enabled, it allows the solder wave(s) to run only when a board is actually within the machine.

Solder Module:  

The solder module features stainless steel construction, a medium capacity solderpot with readily removable heaters, regardless of the solder condition. The Lambda wave is standard and has a maximum 1/2" (12.7 mm) stable height, adjustable by means of an electronic speed controller. The solder temperature controller has high and low limit alarms incorporated in its design. This protects the pump from operating in a solid or "plastic" solder state.

Rollout Jacking Stand:  

The jacking stand is attached to the rear of the machine adjacent to the solder module. This feature is used to roll the solder pot out onto for servicing and maintenance. The height is adjustable via screw pads on the stand legs.

Optional Equipment
FDC-400 Flux Density Controller:  

The FDC unit assures the consistency of flux density. It consists of a density sensor probe and level/temperature probe suspended in the fluxer tank. The FDC-400 regulates the flux and thinner pumps controlling the density of the flux in use.

Wave Fluxer:  

Replaces the standard foam fluxer. Applies flux by pumping a liquid wave of flux to the underside of the PCB as it passes over the fluxer. This type of application is excellent for Surface Mounted Technology (SMT) and other difficult fluxing processes.

Finger Conveyor:  

The finger conveyor is powered by a variable speed DC drive motor and is fixed at a 6° incline. The fingers are attached to a double chain driven by a hex drive gear that floats on a hex drive shaft. The conveyor width is adjustable from the load end of the machine by means of a handwheel. Load guides and 12" unload extensions are standard as well as the finger cleaning system. The finger cleaner provided with this option has a low level protection/alarm circuit.

Motorized Conveyor Width:  

Computer controlled automatic width adjustment with digital readout and manual backup. The width is changed via the operator's set point input.

Finger Masks:  

This feature is designed to mask/shield the gold connectors on the edge of the PCB assembly from exposure to flux and/or solder as the conveyor passes over these modules. The mask functions by placing a shield/mask between the printed circuit board (PCB) and the flux/solder wave.

Cooling Fan Module:  

This option is used to cool the PCB as it leaves the system cabinet. It consists of four (4) small fans mounted in a unique steel housing, designed for maximum cooling effect on the PCB.

Omega Wave:  

The Omega Wave is designed to eliminate soldering defects, especially solder skips, in SMDs wavesoldering. It also improves the soldering of conventional boards by improving through-hole filling.

Additional Preheaters:  

Two (2) overhead and/or one (1) additional bottom preheater for a total of 4 maximum. The overhead preheaters replace the heater tunnels.


This read only JR sensor is used to detect the PCB surface temperature prior to soldering. It has programmable temperature deviation alarms with programmable alarm actions.

Turbulent/Chip Wave:  

The Turbulent Wave is operated independent of the Lambda or the Omega waves. This wave is used for surface mounted device (SMD) board soldering. This wave nozzle is mounted forward of the existing Lambda/Omega nozzle and has its own separate pump motor and control system. This wave produces a pumped, multi-directional wave, allowing solder to reach the more difficult areas of the SMT type boards, ensuring full and proper wetting of all solder contact points.

Additional Emergency push buttons:  

To be mounted on the rear corners of the system cabinet, providing emergency stop controls at each corner of the cabinet.

C02 Fire extinguisher system:  

Mounted internally to the system cabinet with externally mounted controls, used to automatically activate in case of a system fire.

Optional Software:  

Systems Interface Protocol (SIP), Electrosoft/Electrosave -process control software. Used for remote monitoring and process control and management.

System Identification Number
Epk-II SMT:  

Each system/machine is identified by a serial number. This number is inscribed on the name plate of the machine. Locate and note this serial number, it's required for parts procurement and system identification. The serial number has the following format: # 0890503002/LV-220

Program Identification Number
Epk-II SMT:  

The program used to operate the system is stored in the computer memory card. This program controls the overall operation of the machine.

When the system is initially powered up (turned on), the serial number will be displayed in the window located between the two (2) keypads on the control console. The format will be one of two (2) possible displays. This information is required for system upgrading and possible troubleshooting of system operations. The following are examples of the program number:

6-1904-125-XX-1 or 6-1904-103-XX-1 XX = the revision number of this machine's operating program.

125 = normal machine configuration.
103 = a machine configured with one or more of the following options: Pyrometer, Motorized width adjustment, addition of the 4th preheater, with or without Electrosoft and/or SIP (software options).
Technical Data
Models Available:   12" (300 mm) process width - (13" Max. Finger Type)
15" (400 mm) process width - (16" Max. Finger Type)
Power:   220 VAC, 3 Phase, 4 wire, 50/60 Hz or
380 VAC, 3 Phase, 5 wire, 50/60 Hz or
440 VAC, 3 phase, 4 wire, 50/60 Hz
Power Consumption:   13.9 KVA on 12" (300 mm) models
(Add 6.3 KVA per additional preheater.)
15.1 KVA on 15" (400 mm) models
(Add 7.5 KVA per additional preheater.)
Exhaust Data:  

425 cfm (201 Us) total at 0.3" (8 mm) of water; divided evenly between each of the two 6" (152 mm) stacks.

* Exhaust dampers should be added at each stack to assist in balancing the ventilation flow.

Compressed Air Data:  
Fluxer Aerator:   approximate consumption of 2 cfm at 5 psi (0.94 1./s at 35 kPa)
Flux Air knife:   approximate consumption of 5 cfm at 30 psi (2.36 L/s at 138 kPa)
Pressure regulator (inlet connection) limits output to 50 psi (340 kPa) maximum. Air supply to aerator must be clean and dry to prevent clogging and contamination - use oil filter and water trap if necessary.
Conveyor Data:  
Process Speed:   0 to 16 fpm (0 to 5 MPM) ±1% of max. speed
Process Width:   12" or 15" (300 mm or 400 mm)
Fluxer Data:

Foam Height:   1/2" (12.7 mm) dependent on flux foaming properties
Flux Capacity:   12" (300 mm) = 3.35 U.S. gal. (12.68 L)
15" (400 mm) = 3.35 U.S. gal. (12.68 L)
FDC-400 (option):  
Density range:   0.750 - 1.000 ±0.003
Temperature range:   32- 122°F (0-50°C) ±4.5°F (±2.5C)
Set point range:   0.750 - 0.999
(selectable in 0.001 increments)
Finger Cleaner Data:  
Solvent capacity:   1.87 U.S. gal. (7.1 L)
Preheater Data:  
Temperature sensor:   Type K, ungrounded thermocouple
Temperature range:   32 - 1112°F (0- 600°C)
Max Temp:   1112°F (600°C)
Power Consumption:   6.3 KVA on 12" (300 mm) models
7.5 KVA on 15" (400 mm) models
Warm up time:   15 minutes (approx.)
Solder Module Data:  
Solder Capacity:   800 lb (364 kg)
Power Consumption:   5.6 KVA (all models)
Typical Operating Temps:   500°F (260°C)
Mm. Operating Temp:   428°F (220°C)
Max. Operating Temp:   600°F (3 16°C)
Warm up time:   3-4 hours from 75°F to 500°F
(24°C to 260°C)
Carrier Data:  

Standard carriers accept boards up to 12" (300 mm) and 15" (400 mm) wide for respective models. Special carriers are available upon request.

Machine Weight:   1400 lb (635 kg) gross, without solder.
Overall Dimensions:

Used PBC electronic assembly machinery, Developed and Maintained by Petlock Inc. Est. 1978